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学术报告
蔡志楷教授学术报告会
作者:发布时间:2023-12-27

题目:Expectations of Additive Manufacturing (3D Printing) & its Role in the Economy of the Future

时间:2023年12月27日 9:30-11:30

地点:机械与动力工程学院 F210会议室

邀请人:习俊通 教授、陈晓波 助理研究员(智能制造与信息工程研究所)

 

Biography

Professor Chua Chee Kai is the Associate Provost for Research and Cheng Tsang Man Chair Professor at the Singapore University of Technology and Design (SUTD).  Prof Chua’s research area is in 3D Printing & Rapid Prototyping or Additive Manufacturing. He is the foremost expert in Singapore in this area and was awarded the prestigious International Freeform and Additive Manufacturing Excellence (FAME) Award in 2018. Prof Chua is also the most published and most cited scientist in “Rapid Prototyping / Additive Manufacturing” (3D Printing) according to the Web of Science. He has published in more than 500 international journals, conference papers, books, book chapters and patents. He is currently the Editorial board member of International Journal of Advanced Manufacturing Technology, Rapid Prototyping Journal & Journal of Materials Processing Technology and Editor-in-Chief of Virtual & Physical Prototyping, as well as Editor-in-Chief of International Journal of Bioprinting. 

 

Abstract

The talk will introduce briefly what 3D Printing (or officially known as Additive Manufacturing) technology is by exploring its history, benefits, and applications. The session will cover the 5C's of 3D printing and the global industry growth of this rapidly evolving technology, including why Singapore is keen to play a leading role. Additionally, the seminar will highlight how 3D printing has been utilized during the COVID-19 pandemic. Finally, the session will explore the market opportunities and predictions for the future of 3D printing. By the end of this seminar, participants will gain a deeper understanding of 3D printing, its current state, and the trends of 3DP. As the audience may not be familiar with SUTD, the talk will also share briefly about SUTD and its unique blueprint for Higher Education.

 

 

 

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