Topic：Two-Phase Microchannel Cooling of High Heat Flux Computer Chips and Electronics: Fundamental Aspects of the Boiling Processes

Speaker：Prof. John R. Thome，Lausanne, Switzerland

Time：Wednesday，Oct. 24, 2012，10:00 am－11：30am

Venue: Room F210, Mechanical Engineering Building

Abstract: Microchannel flow boiling is an excellent cooling process for high heat flux electronics devices, providing also low energy consumption cooling systems. The Heat Transfer Laboratory (LTCM) has been working on numerous aspects of the two-phase flow and boiling processes in single- and multi-microchannels for the past 12-13 years. This lecture will give an overview of this work (experimental, flow visualization, analytical/physical modeling, numerical simulations and two-phase flow control), highlighting the important aspects and results while also wish to encourage a discussion about current and future issues.

About the Speaker: Dr. John R. Thome is Professor of Heat and Mass Transfer at the Swiss Federal Institute of Technology in Lausanne (EPFL), Switzerland since 1998, where his primary interests of research are two-phase flow and heat transfer. Recently, his work has primarily focused on two-phase flow pattern based heat transfer and pressure drop models for microscale evaporating flows and the development of multi-microchannel evaporators for electronics cooling. He received his Ph.D. at Oxford University, England in 1978. He is the author of four books: Enhanced Boiling Heat Transfer (1990), Convective Boiling and Condensation, 3rd Edition (1994), Wolverine Engineering Databook III (2004) and Nucleate Boiling on Micro-Structured Surfaces (2008). He received the ASME Heat Transfer Division's Best Paper Award in 1998 for a 3-part paper on two-phase flow and flow boiling heat transfer published in the Journal of Heat Transfer and also for another best paper award from the International Journal of Refrigeration for the period 2011-2012. Prof. Thome received the UK Institute of Refrigeration’s J.E. Hall Gold Medal in 2008 for his extensive work in the field of microscale refrigeration heat transfer, and the 2010 ASME Heat Transfer Memorial Award for his work on flow pattern based heat transfer models for macro and micro-scale flows.