Speaker:  Prof. S. C. Yao
          Carnegie Mellon University.USA              

Time:     13:30PM  June 22th, 2009
Location: Room F 210， Mechanical Building A
 
Abstract
 
The reliability issue has become one of the major concerns of the electronics due to the ever-increasing IC miniaturization, complexity and power dissipation.  More than half of the failures of electronics come from thermal over-heating, because the failure rate increases exponentially with temperature.  Therefore, thermal management is a major focus to achieve a better reliability of the electronic products.  

Professor Yao of Mechanical Engineering, Carnegie Mellon University, USA, has been active in fluid mechanics and heat mass transfer research for over 30 years, published over 160 papers. More than 20 Ph.D. students have graduated under his supervision.  His research interests covers nuclear power, cooling of electronics, fuel cell development, and spray combustion. In the last 10 years he has focused on MEMS thermal fluids.  

Dr. Yao received his Ph.D. degree from the University of California, Berkeley at 1974.  After worked at Argonne National Laboratory for three years, he joined Carnegie Mellon University in 1977. In 2005-2006 Prof. Yao served as the interim Department Head at the Mechanical Engineering Department of CMU. 

Dr. Yao has been a FELLOW of the American Society of Mechanical Engineers.   In ASME Heat Transfer Division, he served as the chairman of Fire and Combustion Committee and the Long Range Planning Committee.  He has been serving at the scientific committee in International Conference of Multiphase Flow since 1998, the Program Chair of the Year 2000 National Heat Transfer Conference, and also the Conference Co-chairman, International Symposium on Multiphase Flow and Heat Transfer 2005.