2018-2021, National Natural Science Foundation of China (NSFC), "Heat Transfer enhancment of Crogenic loop Heat Pipe using Micro-nano hybrid wick structures". PI
2015-2018, Key International Cooperation and Exchange Project of National Natural Science Foundation of China , "Efficient Absorption of Solar Energy by Nanofluids to Produce Steam", Main Member.
2014-2017, National Natural Science Foundation of China, "Jet Array Impingement Boiling in Narrow Space".
2013-2015, Shanghai Pujiang Talent Program, "Jet impingement cooling of Large Area and High Heat Flux Density", PI.
2012-2015 ,Marie Curie Actions - International Research Staff Exchange Scheme, Cooling with High Heat Flux Density in Multiphase Flow, Major Member.
2011-2014, Key project of National Natural Science Foundation of China , "Phase Change Heat Transfer Enhanced by Electric Field in Vapor/Liquid/Solid Three-Phase Contact Zone", Subject Leader .
2008-2010, National Natural Science Foundation projects, “Electrohydrodynamics in droplet-based EWOD Microfluidic Chips”, Principle Investigator
2008-2010, Key Projects of Science and Technology Committee of Shanghai, “Bubble Dynamics in Microsystems under the Effect of Electrical Fields”, Cooperative Investigator
2006-2009, Key NSFC projects, “Micro/Nanoscale Heat and Mass Transfer”, Cooperative Investigator
Chen, Y. H.; Hu, W. N.; Wang, J.，Transient effects and mass convection in sessile droplet evaporation: The role of liquid and substrate thermophysical properties，INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2017, 108(B), 2072-2087
Zhang C.Y., Cheng P., Hong F.J., Mesoscale simulation of heater size and subcooling effects on pool, NTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2016, 101, 1331-1342
Chaoyang Zhang， Fangjun Hong*， Ping Cheng， Simulation of liquid thin film evaporation and boiling on a heated hydrophilic microstructured surface by Lattice Boltzmann method, International Journal of Heat and Mass Transfer 07/2015; 86:629-638.
F.J. Hong, C.Y. Zhang, W. He, P. Cheng, G. Chen, Confined jet array impingement boiling of subcooled aqueous ethylene glycol solution,International Communications in Heat and Mass Transfer 56 (2014) 165–173.
Fangjun Hong, Feng Bai, Ping Chen, A Parametric Study of Electrothermal Flow inside an AC EWOD Droplet, International Communications in Heat and Mass Transfer,Volume 55, July 2014, Pages 63–70.
Kai Yang, Fangjun Hong, Ping Cheng, A fully coupled numerical simulation of sessile droplet evaporation using Arbitrary Lagrangian–Eulerian formulation, International Journal of Heat and Mass Transfer 70 (2014) 409–420
Hong F.J. , Cheng P. , Wu H.Y. , Sun Z. , Evaporation/Boiling Heat Transfer on Capillary Feed Copper Particle Sintered Porous Wick at Reduced Pressure, International Journal of Heat and Mass Transfer 2013 (63 ): p.389–400
Hong, F.J., Jiang, D.D., Cheng, P, Frequency-dependent resonance and asymmetric droplet oscillation under ac electrowetting on coplanar electrodes, Journal of Micromechanics and Microengineering, 2012. 22(8)
Hong F. J., Bai F., Cheng P., Numerical simulation of AC electrothermal micropump using a fully coupled model. Microfluidics and Nanofluidics, 2012,13(3): p. 411-420.
Hong, F.J., P. Cheng, and H.Y. Wu, Characterization on the performance of a fractal-shaped microchannel network for microelectronic cooling. Journal of Micromechanics and Microengineering, 2011. 21(6).
Hong, F.J., J. Cao, and P. Cheng, A parametric study of AC electrothermal flow in microchannels with asymmetrical interdigitated electrodes. International Communications in Heat and Mass Transfer, 2011. 38(3): p. 275-279.
Hong, F. and P. Cheng, Three dimensional numerical analyses and optimization of offset strip-fin microchannel heat sinks. International Communications in Heat and Mass Transfer, 2009. 36(7): p. 651-656.
Cao Jun, Cheng Ping, Hong Fangjun, Applications of electrohydrodynamics and Joule heating effects in microfluidic chips: A Review. Science in China: Series E: Technological science, 2009, 52(12): 3477-3490
Cao J.，Cheng P. and Hong F.J., A numerical study of an electrothermal vortex enhanced micromixer, J. of Microfluidics and Nanofluidics, 2008, 5:13-21
Cao Jun, Cheng Ping, Hong Fangjun, A numerical analysis of forces imposed on particles in conventional dielectrophoresis in microchannels with interdigitated electrodes, Journal of Electrostatics, 2008, 66: 620-626
Hong F.J., Cheng P., Ge H. and Goh Teck Joo, Conjugate heat transfer in tree-shaped microchannel network heat sink for integrated microelectronic cooling application, International Journal of Mass and Heat Transfer, 2007,50: 4986-4998
Ping Cheng, Hui-Ying Wu, and Fang-Jun Hong, Phase-change heat transfers in microsystems, J. of Heat Transfer, 2007, 129:101-108
Cao J., Hong F.J. and Cheng P., Numerical Study on Sample Stacking in Capillary Electrophoresis, Chinese Journal of Chromography, 2007,25(2):183-188
Cao J., Hong F.J. and Cheng P., Numerical Analysis of the Influence Factors on Sample Stacking in Capillary Electrophoresis, Chinese Journal of Chromography, 2007, 25(4):482-485
Cao J., Hong F.J. and Cheng P., Numerical study of radial temperature gradient effect on separation efficiency in capillary electrophoresis, International Communications in Heat and Mass Transfer, 2007, 34:1048-1055
Hong F.J. and Qiu H.-H.: Characterization of Variable Thermal Contact Resistance in Rapid Contact Solidification Utilizing Novel Ultrasound Technique, Journal of Heat Transfer, Transactions of the ASME, 2007, 129:1036-1045
Wang W., Hong F. J. and Qiu H. -H., Prediction of Solder Bump Formation in Solder Jet Packaging Process, IEEE Transactions On Components and Packaging, 2006, 29 (3): 486-493
Wang W., Hong F. J. and Qiu H. -H., The Impact of Thermal Contact Resistance on the Spreading and Solidification of a Droplet on a Substrate, Heat Transfer Engineering,2006, 27(9): 68-80
Qiu H.-H, Wang X.S., Hong F. J., Measurements of interfacial film thickness for immiscible liquid-liquid slug/droplet flows, Measurement Science and Technology,2005,16(6):1374-1380
Hong F.J. and Qiu H.–H., Experimental study on rapid solidification process using a novel ultrasound technique, Experimental Thermal and Fluid Science，2005,30(1):17-26
Hong F.J. and Qiu H.–H., Modeling of substrate remelting, flow, and resolidification in microcasting, Numerical Heat Transfer Part A-Applications, 2005, 48(10): 987-1008